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 HITFET=BTS 149
Smart Lowside Power Switch
Features * Logic Level Input * Input Protection (ESD) *=Thermal shutdown with latch * Overload protection * Short circuit protection * Overvoltage protection
* Current
Product Summary Drain source voltage On-state resistance Current limit Nominal load current Clamping energy VDS RDS(on) I D(lim) I D(ISO) EAS 60 18 30 19 V m A A
6000 mJ
limitation
* Status feedback with external input resistor * Analog driving possible
Application
* All kinds of resistive, inductive and capacitive loads in switching or linear applications * C compatible power switch for 12 V and 24 V DC applications * Replaces electromechanical relays and discrete circuits
General Description
N channel vertical power FET in Smart SIPMOS chip on chip technology. Fully protected by embedded protected functions.
V bb
+
LOAD
M
D rain
2
1
IN
dv /d t lim ita tio n
C u rre n t
lim ita tio n
O ve rvoltag e p rotection
ESD
O v erloa d pro te ctio n
O ve rte m pe rature p ro te ctio n
S ho rt c ircu it S h ort circ uit p rotection p ro te ctio n
S o u rce
3
H IT F E T
Page 1
2004-02-02
BTS 149
Maximum Ratings at Tj = 25 C unless otherwise specified Parameter Drain source voltage Drain source voltage for short circuit protection Continuous input current 1) -0.2V VIN 10V VIN < -0.2V or VIN > 10V Operating temperature Storage temperature Power dissipation TC = 25 C Unclamped single pulse inductive energy ID(ISO) = 19 A Electrostatic discharge voltage (Human Body Model) VESD according to MIL STD 883D, method 3015.7 and EOS/ESD assn. standard S5.1 - 1993 Load dump protection VLoadDump2) = VA + VS VIN=low or high; VA =13.5 V td = 400 ms, RI = 2 , ID =0,5*19A td = 400 ms, RI = 2 , ID = 19A DIN humidity category, DIN 40 040 IEC climatic category; DIN IEC 68-1 VLD 110 92 E 40/150/56 3000 V EAS 6000 mJ Tj Tstg Ptot Symbol VDS VDS(SC) IIN no limit | IIN | 2 - 40 ... +150 - 55 ... +150 178 W C Value 60 32 mA Unit V
Thermal resistance junction - case: junction - ambient: SMD version, device on PCB: 3) RthJC RthJA RthJA 0.7 75 45 K/W
1In case of thermal shutdown a minimum sensor holding current of 500 A has to be guaranteed (see also page 3). 2V Loaddump is setup without the DUT connected to the generator per ISO 7637-1 and DIN 40839 3 Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm 2 (one layer, 70m thick) copper area for Drain connection. PCB mounted vertical without blown air.
Page 2
2004-02-02
BTS 149
Electrical Characteristics Parameter at Tj=25C, unless otherwise specified Characteristics Drain source clamp voltage Tj = - 40 ...+ 150C, ID = 10 mA Off state drain current VDS = 32 V, Tj = -40...+150 C, VIN = 0 V Input threshold voltage ID = 3,9 mA Input current - normal operation, ID1If the input current is limited by external components, low drain currents can flow and heat the device. Auto restart behaviour can occur.
Page 3
2004-02-02
BTS 149
Electrical Characteristics Parameter at Tj=25C, unless otherwise specified Characteristics Initial peak short circuit current limit VIN = 10 V, VDS = 12 V Current limit 1) VIN = 10 V, VDS = 12 V, tm = 350 s, Tj = -40...+150 C Dynamic Characteristics Turn-on time Turn-off time Slew rate on Slew rate off VIN to 90% ID : VIN to 10% ID : 70 to 50% Vbb : ton toff -dVDS/dton dVDS/dtoff 40 70 1 1 100 170 3 3 V/s s RL = 1 , VIN = 0 to 10 V, Vbb = 12 V RL = 1 , VIN = 10 to 0 V, Vbb = 12 V RL = 1 , VIN = 0 to 10 V, Vbb = 12 V 50 to 70% Vbb: RL = 1 , VIN = 10 to 0 V, Vbb = 12 V ID(lim) 30 40 60 ID(SCp) 130 A Symbol min. Values typ. max. Unit
Protection Functions
Thermal overload trip temperature Unclamped single pulse inductive energy ID = 19 A, Tj = 25 C, Vbb = 32 V ID = 19 A, Tj = 150 C, Vbb = 32 V Tjt EAS 6000 1800 150 165 C mJ
Inverse Diode
Inverse diode forward voltage IF = 5*19A, tm = 300 S, VIN = 0 V VSD 1.1 V
1Device switched on into existing short circuit (see diagram Determination of I D(lim)). If the device is in on condition and a short circuit occurs, these values might be exceeded for max. 50 s.
Page 4
2004-02-02
BTS 149
Block Diagramm Terms Inductive and overvoltage output clamp
D
RL
I IN
1 IN HITFET
V Z
D
2
ID VDS Vbb
S
VIN
S
3
HITFET
Short circuit behaviour
Input circuit (ESD protection)
V IN I D(SCp)
IN
ID
ESD-ZD I Source
I D(Lim)
ESD zener diodes are not designed for DC current > 2 mA @ VIN >10V.
t0
tm
t1
t2
t0: Turn on into a short circuit tm: Measurementpoint for ID(lim) t1: Activation of the fast temperature sensor and regulation of the drain current to a level where the junction temperature remains constant. t2: Thermal shutdown caused by the second temperature sensor, achieved by an integrating measurement.
Page 5
2004-02-02
BTS 149
Maximum allowable power dissipation Ptot = f(Tc )
BTS 149
On-state resistance RON = f(Tj ); ID=19A; VIN =10V
40
190
W
m
30
160
Ptot
RDS(on)
140 120 100 80 60
25
20
max.
15
typ.
10 40 20 0 0 5
20
40
60
80
100
120
C 150
160
0 -50
-25
0
25
50
75
100
C
150
Tj
On-state resistance RON = f(Tj ); ID= 19A; V IN=5V
45
Typ. input threshold voltage VIN(th) = f(Tj); ID =3,9mA; VDS =12V
2.0
V
m
35
1.6
RDS(on)
30
max.
VIN(th)
typ.
1.4 1.2 1.0
25 20 15 10 5 0 -50
0.8 0.6 0.4 0.2 -25 0 25 50 75 100
C
150
0.0 -50
-25
0
25
50
75
100
C
150
Tj
Page 6
Tj
2004-02-02
BTS 149
Typ. transfer characteristics ID = f(VIN); VDS =12V; Tj =25C
40
A A 10V 6V 5V
Typ. output characteristic ID = f(VDS); Tj =25C Parameter: VIN
50
30
ID
ID
25
30
4V
20 20
Vin=3V
15
10 10 5
0 0
1
2
3
4
5
6
C
8
0 0
1
2
3
V
5
Tj
VDS
Transient thermal impedance Z thJC = f (t p) parameter : D = t p/T
10
K/W
0
D=0.5 0.2 0.1 0.05 0.02 0.01 0.005
10
-1
ZthJC
10
-2
10
-3
0
10
-4
10
-7
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
s
10
2
tP
Page 7
2004-02-02
BTS 149
Application examples: Status signal of thermal shutdown by monitoring input current
R St
IN D S V bb
C
V IN
HITFET
V
V IN
thermal shutdown
V = RST *IIN(3)
Page 8
2004-02-02
BTS 149
Package P-TO220-3-45 Ordering Code Q67060-S6503-A3
4.4 9.9 8 1.3 0.2 2.4
Package P-TO220-3-1
Ordering Code Q67060-S6503-A2
10.5
1.5
3.6
0.75
1.05 2.54
0.5
GPT05164
1) shear and punch direction no burrs this surface
.
1.5
9.2
1)
Page 9
2004-02-02
BTS 149
Revision History : Previous version : Page 4 2004-02-02 2000-05-19
Subjects (major changes since last revision) ID(lim) from max=55A to max=60A
For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon Technologies Companies and Representatives worldwide: see our webpage at http://www.infineon.com HITFET(R), SIPMOS(R) are registered trademarks of Infineon Technologies AG.
Edition 2004-02-02 Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 Munchen, Germany (c) Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Page 10
2004-02-02


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